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Thermal Bonding Technique for XPS- multi layer boards

The SMB Thermal bonding station enables the full-faced welding of two XPS-boards to one homogeneous 2-layer board with double thickness.

The station can be integrated directly (or in a by-pass) into existing or new planed XPS production lines. As well it is possible to use the Thermal bonding station in an off-line solution for the production of thick multi-layer XPS panels (up to 600mm) with very good λ-value for special roadwork and building projects.

The benefits:
- Higher production flexibility and less changeover times
- Material savings by lower density in combination with
- XPS-panels with better λ-value
- Doubling of panel thickness by integration in existing XPS-lines

Exhibitor: SMB-DAVID finishing lines GmbH